SD2931-14

Overview

The SD2931-14 is a gold metallized N-channel MOS field-effect RF power transistor from the SD2931 series, manufactured by STMicroelectronics. Designed for large signal applications up to 230 MHz with a 50 V DC supply, it delivers a minimum output power of 150 W and a typical gain of 14 dB at 175 MHz. The device features a surface-mount M174 package with four pins, supporting continuous drain currents up to 20 A. It operates within a temperature range of -65°C to +200°C and offers high thermal stability suitable for industrial, scientific, and medical (ISM) environments.

Feature Summary

• Gold metallization for enhanced reliability
• Excellent thermal stability in rugged conditions
• Common source configuration for efficient amplification
• Thermally enhanced packaging to reduce junction temperatures

Applications

• Industrial, Scientific, and Medical (ISM) equipment
• HF/VHF/UHF RF power amplification
• Large signal applications up to 230 MHz

Procurement Notes

Verify the specific suffix against official STMicroelectronics documentation to confirm electrical equivalence and package compatibility. Ensure the ordering code matches the required moisture resistance and thermal performance specifications for your target application environment.

Selection Notes

Select this component for designs requiring high power density and thermal resilience in ISM bands. Compare thermal resistance values against alternative packages if operating near maximum temperature limits. Confirm that the 50 V DC supply constraint aligns with the system's power architecture.

Part Context

This part belongs to the SD2931 family of HF/VHF/UHF N-channel power MOSFETs. It shares electrical characteristics with variants like the SD2931-10 but may differ in mechanical or thermal packaging details. The series is engineered for robustness in critical reliability applications.

Replacement Considerations

Check for electrically identical alternatives within the SD2931 series, such as the SD2931-10MR, which offers improved thermal capability. Verify pinout and package dimensions before substitution.