SI3469DV-T1-E3

Single FETs, MOSFETs Overview

The Vishay Siliconix SI3469DV-T1-E3 is a P-Channel MOSFET utilizing TrenchFET technology, housed in a TSOP-6 surface-mount package. It features a drain-source voltage of -20 V and a continuous drain current of -6.7 A at 25 °C. The on-state resistance is specified as 0.030 Ω at VGS = -10 V and 0.051 Ω at VGS = -4.5 V. The device supports an operating junction temperature range from -55 °C to +150 °C with a maximum power dissipation of 2.0 W.

Single FETs, MOSFETs Feature Summary

• TrenchFET Power MOSFET technology for optimized performance
• Halogen-free construction compliant with IEC 61249-2-21
• RoHS Directive 2002/95/EC compliant

Single FETs, MOSFETs Applications

• Load Switch applications
• Notebook PC systems
• Game Machine circuits
• Desktop computer electronics

Single FETs, MOSFETs Procurement Notes

Verify the specific ordering suffix against official documentation to confirm lead-free status and halogen-free compliance. The -E3 suffix indicates lead-free composition. Confirm availability through authorized distributors as production status may vary. Ensure component authenticity by sourcing from verified supply chain channels.

Single FETs, MOSFETs Selection Notes

Select this component for low-voltage P-channel switching requirements where compact TSOP-6 packaging is necessary. Evaluate thermal management strategies based on the specified junction-to-ambient resistance values. Verify gate drive voltage levels align with the specified RDS(on) thresholds for optimal conduction efficiency.

Single FETs, MOSFETs Part Context

This part belongs to the Vishay Siliconix Si3469DV series of P-Channel MOSFETs. It is designed for general-purpose switching applications requiring robust performance in small form factors. The TSOP-6 package provides efficient heat dissipation through the drain pins connected to the substrate.

Single FETs, MOSFETs Replacement Considerations

Consult official datasheets for direct pin-compatible alternatives within the same voltage and current ratings. Verify that any substitute maintains identical package dimensions and thermal characteristics to ensure seamless integration into existing PCB layouts.