SIGC14T60NCX1SA7

Description：IGBT NPT 600V 15A DIE
Series：-

SKU:3d8670b19879 Category: Single IGBTs Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT NPT 600V 15A DIE
Series：-
Mfr：Infineon Technologies
Package：Bulk
IGBT Type：NPT
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：15 A
Current - Collector Pulsed (Icm)：45 A
Vce(on) (Max) @ Vge, Ic：2.5V @ 15V, 15A
Power - Max：-
Switching Energy：-
Input Type：Standard
Gate Charge：-
Td (on/off) @ 25°C：21ns/110ns
Test Condition：300V, 15A, 18Ohm, 15V
Reverse Recovery Time (trr)：-
Operating Temperature：-55°C ~ 150°C (TJ)
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Die
Grade：-
Qualification：-

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SIGC14T60NCX1SA7

Overview

The SIGC14T60NCX1SA7 is a bare IGBT chip utilizing NPT technology with a 600V collector-emitter voltage rating. It features a 15A DC collector current and a 100µm die thickness. The component exhibits a positive temperature coefficient for easy paralleling. Key electrical parameters include a maximum VCE(sat) of 2.5V at 15A, a VGE(th) range of 4.5V to 6.5V, and an operating junction temperature up to 150°C.

Feature Summary

Utilizes Non-Punch-Through (NPT) technology for robust performance
Features a positive temperature coefficient facilitating parallel operation
Designed as a bare die for integration into custom power modules

Applications

Industrial motor drives
Power module assembly
Resonant applications

Procurement Notes

Verify the specific ordering code Q67050-A4135-A001 against the required suffix X1SA7 to ensure correct packaging or handling specifications. Confirm that the application environment supports bare die mounting requirements, including thermal interface materials and wire bonding compatibility, prior to procurement.

Selection Notes

Select this component for designs requiring high-voltage isolation in modular configurations. Ensure the system layout accommodates the 3.8 x 3.8 mm die size and utilizes appropriate epoxy or soft solder die bonding methods. Verify gate drive voltages remain within the ±20V limit to prevent device failure.

Part Context

This part belongs to Infineon's discrete IGBT chip portfolio, specifically engineered for internal use in larger power assemblies rather than direct PCB mounting. It serves as a fundamental switching element within intelligent power modules, leveraging mature NPT technology for reliable industrial operation.

Replacement Considerations

Direct replacements require matching the 600V rating, 15A current capacity, and identical 3.8x3.8mm die dimensions. Verify that alternative chips support the same Al wire bonding and epoxy/soft solder die attachment processes.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.