SIGC81T60NCX7SA2

SIGC81T60NCX7SA2

  • Description:IGBT NPT 600V 100A DIE
  • Series:-

SKU:177b5db0ef3e Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 100A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):100 A
  • Current - Collector Pulsed (Icm):300 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 100A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:95ns/200ns
  • Test Condition:300V, 100A, 2.2Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC81T60NCX7SA2

Overview

The SIGC81T60NCX7SA2 is a silicon carbide (SiC) MOSFET manufactured by Infineon Technologies. It features a 600V voltage rating and is designed for high-efficiency power conversion applications. The component utilizes advanced SiC technology to minimize switching losses and improve thermal performance compared to traditional silicon devices. This specific part number denotes a wafer-level configuration intended for integration into larger power modules or custom packaging solutions rather than as a standalone discrete package.

Feature Summary

  • Utilizes silicon carbide semiconductor material for superior thermal conductivity and breakdown strength
  • Engineered for low on-state resistance to enhance overall system efficiency in power electronics
  • Capable of operating at higher temperatures with reduced cooling requirements

Applications

  • High-power density DC-DC converters
  • Industrial motor drive inverters
  • On-board chargers for electric vehicles

Procurement Notes

Verify the exact physical dimensions and electrical characteristics against the official Infineon datasheet before procurement, as wafer-level components require specific handling and integration processes. Confirm that the supplier provides traceability documentation and quality certificates required for automotive or industrial certifications. Ensure compatibility with your module assembly equipment.

Selection Notes

Select this component when designing systems requiring high-frequency operation and elevated temperature tolerance. Consider the total cost of ownership including thermal management infrastructure. Evaluate the need for custom packaging solutions since this is a wafer product. Compare performance metrics against other SiC options from Infineon's portfolio to ensure optimal fit for your specific voltage and current requirements.

Part Context

This part belongs to Infineon's broader portfolio of silicon carbide power devices, which are critical for next-generation energy-efficient electronics. The SIGC series represents specialized wafer technologies used in high-volume manufacturing of power modules. These components support the industry shift towards more compact and efficient power systems in automotive and industrial sectors.

SIGC81T60NCX7SA2SIGC81T60NCX7SA2

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