Memory IC SM662GXB-C6V product image

SM662GXB-C6V

$13.77
  • Description:IC
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Bulk

SKU:a43a1bdfc27c Category: Brand:

  
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SM662GXB-C6V is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SM662GXB-C6V

  • Description:IC
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Bulk
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:256Gbit
  • Memory Organization:32G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-BGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for SM662GXB-C6V

SM662GXB-C6V

Memory IC Overview

The SM662GXB-C6V is a Ferri-eMMC flash memory component manufactured by Silicon Motion, Inc. It features a storage capacity of 32Gb with an organization of 4G x 8 bits. The device utilizes 3D TLC NAND technology and adheres to the eMMC interface standard. It is housed in a 100-LBGA package measuring 14x18mm. The operational temperature range extends from -25°C to 85°C.

Memory IC Feature Summary

  • Integrates 3D TLC NAND flash technology for high-density data storage within a compact form factor.
  • Supports eMMC interface protocols for standardized communication with host systems.
  • Designed for commercial temperature operation environments.

Memory IC Applications

  • Embedded multimedia cards
  • Consumer electronics storage modules
  • Industrial control system memory

Memory IC Procurement Notes

Verify the specific suffix C6V against official Silicon Motion documentation to confirm the exact capacity and temperature grade. Ensure compatibility with the target host controller's eMMC version support. Check for any recent Product Change Notices (PCN) regarding package or material updates before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 32Gb capacity is required in a 100-ball BGA package. It is suitable for applications needing 3D TLC density at commercial temperatures. Compare against the SM662PEB-BDSS if higher capacity or extended temperature ranges are necessary for the specific design constraints.

Memory IC Part Context

This part belongs to the Ferri-eMMC series from Silicon Motion, which focuses on cost-effective NAND solutions. The series includes variants like the SM662GXA evaluation board and the SM662PAC-BESS. These components are designed to provide reliable non-volatile storage for embedded applications requiring standard interfaces.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for the SM662GXB-C6V are not available in the provided source data. Consult Silicon Motion directly for current equivalent recommendations.

SM662GXB-C6VSM662GXB-C6V
$13.77
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