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TLE2061MLB is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP JFET 1 CIRCUIT TO99-8. Review the specifications below when checking this part for your BOM.
The TLE2061MLB is a single JFET-input operational amplifier from the Texas Instruments TLE206x family, housed in an 8-lead TO-99 metal can package. It features a gain-bandwidth product of 2 MHz and a slew rate of 3.4 V/µs. The device operates on supply voltages ranging from ±3.5 V to ±18 V (7 V to 36 V total). Key electrical characteristics include an input bias current of 4 pA, an input offset voltage of 600 µV, and an input voltage noise density of 40 nV/√Hz. It supports an industrial temperature range of -55°C to +125°C.
Verify the specific suffix 'MLB' against the official Texas Instruments datasheet to confirm the exact pinout, lead finish, and temperature grade. Ensure the procurement source provides traceability documentation for the metal can package variant. Cross-reference the manufacturer part number with authorized distributors to avoid obsolete or non-compliant stock.
Select this component when low input bias current and high output drive are required simultaneously. The TO-99 package is suitable for applications demanding superior thermal performance and hermetic sealing compared to plastic packages. Consider the 2 MHz bandwidth and 3.4 V/µs slew rate for moderate-speed precision applications.
The TLE2061MLB belongs to the TLE206x family of high-voltage FET-input operational amplifiers. This family is characterized by combining low power consumption with high output drive capabilities. The TLE2061 variant specifically offers a 2 MHz gain-bandwidth product. The ML designation indicates the metal can package form factor.
Compatible substitutes within the same family include TLE2061AI and TLE2061CI, though these typically utilize plastic DIP packages rather than the TO-99 metal can. Verify that any replacement maintains the required operating temperature range and package compatibility for the specific application.
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