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TNY277GN-TL is listed in the AC DC Converters, Offline Switchers range at ChipApex. The manufacturer field lists Power Integrations. Its product description is IC OFFLINE SWITCH FLYBACK 8SMD. Review the specifications below when checking this part for your BOM.
The TNY277GN-TL is an AC-DC offline switcher from the TinySwitch-III family, integrating a 700V power MOSFET, oscillator, and control circuitry. It supports flyback topology with a switching frequency of 132 kHz. The device operates on an input voltage range of 85 VAC to 265 VAC. Maximum output power is rated at 18 W for adapter applications and 23.5 W for peak/open-loop conditions at 230 VAC. It features a maximum duty cycle of 65% and a supply current of 365 µA. The component is housed in an 8-SMD (7 pins)鸥翼 package.
Verify the specific suffix TL against official Power Integrations documentation to confirm tape-and-reel packaging specifications. Ensure the ordering part number matches the required pin configuration and thermal characteristics. Cross-reference datasheet revisions to validate electrical parameters before finalizing procurement orders.
Select this component for designs requiring high flexibility and extended power ranges within low-cost systems. It is suitable for applications demanding minimal external component counts and single-sided PCB layouts. Consider its enhanced safety features and ability to meet global energy regulations such as CEC standards when evaluating alternative solutions.
This device belongs to the TinySwitch-III series, which offers enhanced flexibility compared to previous generations. The series integrates high-voltage switches with advanced control logic to simplify design. It targets cost-sensitive applications where reliability and regulatory compliance are critical requirements for mass-produced electronic devices.
Adjacent models within the TinySwitch-III series may serve as substitutes. Substitution typically requires adjusting the external capacitor that sets the current limit parameter. Verify pin compatibility and thermal performance before implementing any cross-model replacements.
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