SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TSM200N03DPQ33 RGG is a dual N-channel MOSFET from Taiwan Semiconductor, rated for a drain-source voltage of 30 V. It features a maximum on-state resistance of 20 mΩ at VGS = 10V and 30 mΩ at VGS = 4.5V. The device supports a continuous drain current of 20 A at TC = 25°C and handles pulsed currents up to 80 A. Total gate charge is 4.1 nC. It utilizes a PDFN33 Dual package with a junction-to-case thermal resistance of 6.4 °C/W and operates within a temperature range of -55°C to +150°C.
Verify the specific ordering suffix 'RGG' against the manufacturer's datasheet to confirm packaging details, such as reel size and quantity per reel. Ensure compliance requirements like RoHS and halogen-free status match project specifications before finalizing procurement orders.
Select this component for applications requiring low on-resistance and fast switching in compact surface-mount designs. Evaluate thermal management needs based on the specified junction-to-case resistance and ensure the operating voltage remains within the 30 V limit.
This part belongs to the TSM200N03D series of dual N-channel power MOSFETs manufactured by Taiwan Semiconductor Corporation. It is designed for general-purpose switching applications where space efficiency and electrical performance are prioritized.
Consult official substitution lists or cross-reference databases for verified equivalent parts. Confirm that any alternative component matches the PDFN33 Dual package dimensions and electrical ratings before implementation.
The maximum continuous drain current is 20 A at a case temperature of 25°C.
No, the maximum drain-source voltage is limited to 30 V.
The total gate charge is typically 4.1 nC under standard test conditions.