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The TT8K11TCR is a dual N-channel silicon MOSFET manufactured by ROHM Semiconductor, designed for low-voltage drive applications. It features a TSST-8 surface-mount package with two independent channels. Key electrical parameters include a drain-source breakdown voltage (Vdss) of 20 V and a continuous drain current (Id) of 2.5 A. The device exhibits a typical on-state resistance (Rds(on)) of 49 mΩ at a gate-source voltage (Vgs) of 4.5 V. Additional specifications include a gate charge (Qg) of 12 nC at 4.5 V, a threshold voltage (Vgs(th)) of 1 V, and a maximum power dissipation (Pd) of 650 mW. The component supports an operating temperature range from -55°C to +150°C.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct packaging configuration. Confirm RoHS compliance status through the relevant datasheet revision. Cross-reference the component code with authorized distributor catalogs to validate authenticity and traceability before finalizing procurement orders.
Select this component when a dual N-channel configuration is required for space-constrained designs. Ensure the application voltage remains below the 20 V drain-source limit. Verify that the thermal management strategy accommodates the 650 mW power dissipation rating under expected load conditions.
This part belongs to ROHM's series of logic-level MOSFETs intended for portable electronics and battery-powered devices. The TSST-8 package provides a balance between thermal performance and board space efficiency. It serves as a discrete solution for driving loads in systems requiring low control voltages.
Public confirmed substitute part numbers are not available in the provided source material.