VSM-08-50-100-50-06-N1

Overview

The VSM-08-50-100-50-06-N1 is a vertical male board stacking connector from the AirBorn verSI series. It features a 1.27 mm pitch and is configured with 8 rows and 50 columns, providing 400 circuits. The connector utilizes a through-hole termination style and includes fixed jacknuts for mounting on boards with thicknesses between 0.125 and 0.250 inches. It has a 10.00 mm board spacing and a tail length of 0.172 inches.

Feature Summary

• Vertical male interface designed for board stacking applications
• Compliant with MIL-DTL-83513 military specifications
• Gold-plated contacts for reliable signal integrity
• Fixed jacknut mounting system for secure installation

Applications

• Military aerospace electronic systems
• High-reliability defense communication equipment
• Board-to-board interconnects in rugged environments

Procurement Notes

Verify the specific ordering suffix against the manufacturer's latest datasheet to ensure correct configuration. Confirm that the fixed jacknut specification matches the target board thickness requirements. Check for any recent product change notifications or obsolescence notices before finalizing procurement plans.

Selection Notes

Select this component when a vertical male plug with high pin count density is required. Ensure the design accommodates the 1.27 mm pitch and 10.00 mm board spacing constraints. Verify compatibility with the corresponding receptacle series for proper mating engagement.

Part Context

This part belongs to the AirBorn verSI rectangular connector family, which is widely used in demanding industrial and military sectors. The series offers various termination options and row/column configurations to meet diverse connectivity needs while maintaining strict environmental resilience standards.

Replacement Considerations

Direct substitutes within the same series include VSM-08-50-100-50-06-G or variants with different plating or mounting hardware. Cross-series replacements require careful evaluation of pitch, contact arrangement, and mechanical envelope dimensions.