SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSM-10-30-200-50-06-N1 is a rectangular MIL-Spec connector from the AirBorn verSI series, manufactured by Molex. It features a 0.050-inch (1.27mm) pitch with a plastic body and vertical through-hole termination. The component provides 300 circuits arranged in 10 rows and 30 columns. Key specifications include an 8.00mm board spacing, a 0.140-inch tail length, and fixed jacknuts for boards up to 0.125 inches thick. Contact materials are phosphor bronze with gold plating, rated for 2A current.
Verify the specific ordering suffix against official Molex/AirBorn documentation to ensure correct configuration. Confirm compliance with applicable military specifications and environmental ratings prior to integration. Cross-reference datasheets for precise mechanical dimensions and mating partner requirements.
Select this component for applications requiring high-density interconnects within strict space constraints. Ensure the design accommodates the specified 0.050-inch pitch and vertical through-hole mounting style. Verify that the operating environment aligns with the material temperature ratings and current capacity limits defined in the technical data.
This part belongs to the AirBorn verSI series, which specializes in high-density rectangular connectors. The series is widely used in commercial aerospace, defense, and space sectors. Integration into the Molex portfolio maintains original part numbers and engineering support while leveraging expanded manufacturing resources.
The contacts are made of phosphor bronze with gold plating.
Yes, it complies with MIL-DTL-83513 specifications.

As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More