XC7Z045-1FBG676C

Soc System On Chip Overview

The XC7Z045-1FBG676C is a Zynq-7000 SoC FPGA from AMD/Xilinx, integrating dual-core ARM Cortex-A9 processors with Artix-7 programmable logic. It features 28nm technology, offering 330K logic cells and 17.6 Mbit embedded memory. The device supports up to 850 MHz processor clock speeds and includes extensive peripheral interfaces such as Gigabit Ethernet, USB 2.0, and SDIO. Operating within commercial temperature ranges (0°C to +85°C), it utilizes an FCBGA-676 package for high-density interconnects.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining processing system and programmable logic
• Integrated dual-core ARM Cortex-A9 MPCore subsystem
• High-speed serial transceivers for data communication
• Comprehensive set of standard peripheral controllers

Soc System On Chip Applications

• Industrial automation control systems
• Medical imaging equipment signal processing
• Wireless infrastructure baseband units
• Test and measurement instrumentation

Soc System On Chip Procurement Notes

Verify the specific suffix 'C' indicates commercial temperature range compliance. Confirm package integrity upon receipt. Check RoHS status against current regulatory requirements. Ensure ESD handling protocols are followed during installation. Validate authenticity through official AMD distribution channels.

Soc System On Chip Selection Notes

Compare resource requirements against XC7Z020 or XC7Z035 variants if lower capacity suffices. Consider speed grade '-1' versus '-2' based on timing closure needs. Evaluate power consumption profiles relative to thermal constraints in the target enclosure. Assess software toolchain compatibility for the chosen design complexity.

Soc System On Chip Part Context

This component belongs to the Zynq-7000 family, bridging general-purpose processing and reconfigurable hardware. It succeeds earlier single-function FPGAs by enabling system-level integration. The FBG676 package provides necessary pin counts for complex I/O requirements while maintaining manageable board space.

Soc System On Chip Replacement Considerations

XC7Z045-1FBG676I serves as the industrial temperature equivalent. XC7Z035-1FBG676C offers reduced resources but identical pinout. XC7Z020-1CLG484I differs significantly in package and resource density.