XCVM1302-2HSINSVF1369

Soc System On Chip Overview

The XCVM1302-2HSINSVF1369 is a Versal Adaptive SoC from AMD/Xilinx, built on the 7nm Versal architecture. It integrates ARM Cortex-A72 and Cortex-R5F processor cores within a 1369-ball package. This device is optimized for connectivity, inline acceleration, and diverse workloads, featuring PCIe Gen5/Gen4 compliance, high-performance GPIO, and support for 400G high-speed encryption.

Soc System On Chip Feature Summary

• Versal Prime series optimization for connectivity and inline acceleration
• Integration of hardened PCIe Gen5/Gen4 interfaces
• Support for 400G high-speed encryption capabilities

Soc System On Chip Applications

• Data center network acceleration
• Storage acceleration systems
• 5G xHaul infrastructure

Soc System On Chip Procurement Notes

Verify the specific suffix HSIN against official AMD documentation to confirm pinout and electrical characteristics. Ensure compatibility with the required PCB stack-up for the 1369-ball FCBGA package. Confirm RoHS compliance status through the manufacturer's current certification records before procurement.

Soc System On Chip Selection Notes

Select this model when requiring Versal Prime performance levels for connectivity applications. Compare resource availability against higher-tier Versal Premium devices if AI Engine capacity is not required. Validate that the 1369-ball package fits the target form factor constraints.

Soc System On Chip Part Context

This component belongs to the AMD Versal Adaptive SoC family, specifically the Prime series. It targets mid-range market segments requiring high bandwidth DDR memory interfaces and low-latency inline acceleration for data plane processing tasks in modern networking environments.

Soc System On Chip Replacement Considerations

Consult the AMD Versal Product Selector for direct functional equivalents. Verify pin-to-pin compatibility with XCVM1302 variants sharing the SVF1369 package code.