XCVM1502-1LSINFVB1369

Soc System On Chip Overview

The XCVM1502-1LSINFVB1369 is a System-on-Chip FPGA from the AMD Versal Premium series. It integrates programmable logic, AI engines, and ARM processor cores on a single die. The device utilizes an FCBGA-1369 package for surface mount installation. It operates within a temperature range of -40°C to +110°C and requires a core supply voltage of 800 mV. This component supports high-performance adaptive computing applications requiring significant parallel processing capabilities.

Soc System On Chip Feature Summary

• Integrates adaptive compute architecture with programmable logic and AI engines
• Combines ARM processor subsystems with high-speed interconnects
• Supports advanced security features including built-in encryption engines

Soc System On Chip Applications

• High-performance networking infrastructure
• Artificial intelligence inference acceleration
• Data center storage acceleration

Soc System On Chip Procurement Notes

Verify the specific suffix INFVB1369 against official AMD documentation to confirm pinout compatibility and thermal specifications. Ensure the ordering information matches the required speed grade and operating temperature range. Confirm RoHS compliance status through the manufacturer's current product compliance declarations before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this model when Versal Premium architecture performance is required in a 1369-ball form factor. Compare resource utilization against XCVM1502 variants with different package sizes to ensure physical fitment constraints are met. Validate that the 800 mV core voltage requirement aligns with the target power delivery network design.

Soc System On Chip Part Context

This part belongs to the AMD Versal SoC FPGA family, which merges adaptive compute capabilities with traditional CPU functions. The XCVM1502 designation indicates a specific resource tier within the Premium series, offering a balance of logic density and AI engine count suitable for complex embedded systems.

Soc System On Chip Replacement Considerations

Consult AMD official substitution guides for compatible Versal devices. Verify mechanical footprint equivalence if replacing with other 1369-ball packages. Ensure functional parity in logic resources and memory blocks before considering alternative part numbers.