1N4988US

Single Zener Diodes Overview

The Microchip Technology 1N4988US is a surface mount Zener voltage regulator with a nominal breakdown voltage of 180 V. It operates within a junction temperature range of -65°C to +175°C and dissipates up to 5 Watts at an ambient case temperature of 140°C. The device features a maximum reverse leakage current of 2 µA and a dynamic impedance of 450 Ohms at the test current of 5 mA. It utilizes a voidless hermetically sealed glass package with tungsten slugs and copper end caps.

Single Zener Diodes Feature Summary

• Military qualified to MIL-PRF-19500/356 for high-reliability applications
• Voidless hermetically sealed glass construction with internal metallurgical bonds
• Triple-layer passivation for enhanced robustness
• Inherently radiation hard

Single Zener Diodes Applications

• High-reliability aerospace systems
• Defense electronics requiring failure-free operation
• Radiation-hardened circuit protection

Single Zener Diodes Procurement Notes

Verify that the component matches the specific military qualification standard MIL-PRF-19500/356. Confirm the package type is the E-Package (D-5B) surface mount variant. Ensure the supplier provides traceability documentation consistent with the original manufacturer's specifications for this series.

Single Zener Diodes Selection Notes

Select this component when a 5 Watt surface mount Zener diode with strict environmental tolerance is required. The 180 V rating suits high-voltage regulation needs. Consider the thermal resistance of 7°C/W for heat dissipation planning in enclosed designs.

Single Zener Diodes Part Context

This part belongs to the 1N4954US through 1N4996US series of surface mount Zener regulators. These devices are designed as industry-standard replacements for axial-leaded versions, offering identical electrical performance in a compact footprint suitable for automated assembly processes.

Single Zener Diodes Replacement Considerations

The axial-leaded equivalent is the 1N4988. Verify pinout compatibility and mounting constraints when substituting between surface mount and through-hole variants.