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1N5271BUR is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ZENER 100V 500MW DO213AA. Review the specifications below when checking this part for your BOM.
The Microchip Technology 1N5271BUR is a surface mount Zener diode designed for voltage regulation applications. It features a nominal Zener voltage of 100 V with a standard tolerance of 5%. The device operates within a power dissipation rating of 500 mW and utilizes the DO-213AA (SMB) package configuration. Electrical characteristics include a maximum reverse leakage current of 100 nA and a Zener impedance of 48 Ohms at the test current of 2.5 mA. The component supports an extended operating temperature range from -65°C to +175°C, ensuring reliability in demanding environments.
Verify the specific suffix designation against official Microchip documentation to confirm exact electrical tolerances and screening levels. Ensure the procurement channel provides valid traceability records for hermetically sealed components. Confirm that the delivered package matches the specified DO-213AA form factor to guarantee compatibility with existing PCB footprints and assembly processes.
Select this component when a robust surface mount solution is required for high-voltage regulation tasks. The 1N5271BUR offers a direct replacement for traditional axial-leaded equivalents while maintaining high thermal stability. Consider the 500 mW power rating and low leakage current when designing circuits that operate near the upper limits of the specified temperature range.
This part belongs to the 1N5221BUR-1 through 1N5281BUR-1 series of 0.5 W Zener voltage regulators. These devices provide surface mount versions of popular JEDEC registered parts, utilizing a metallurgically bonded glass construction. The series covers a wide voltage range from 2.4 V to 200 V, offering various tolerance options including 5% and 10% standards.
The 1N5271BUR uses the DO-213AA (SMB) surface mount package.
Yes, the device features a hermetically sealed metallurgically bonded glass package.
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