SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 20848606 is a front panel kit designed for industrial electronic packaging systems. It features a hinged configuration with dimensions of 4U height and 63 HP width. The component is constructed from aluminum material with an anodized front surface finish and conductive rear properties to support shielding requirements. This part serves as a structural interface element within subrack assemblies, providing access and protection for mounted modules.
Verify the exact part number designation against official nVent SCHROFF documentation to ensure compatibility with specific subrack series. Confirm mechanical fitment parameters including unit height and horizontal pitch alignment prior to procurement. Cross-reference manufacturer specifications for material composition and surface treatment requirements to meet environmental and shielding standards.
Select this component based on required physical dimensions of 4U by 63 HP and the need for a hinged access mechanism. Ensure the application demands shielded enclosure properties compatible with the conductive rear surface design. Validate that the aluminum anodized finish meets the necessary corrosion resistance and aesthetic specifications for the intended industrial environment.
This component belongs to the nVent SCHROFF range of box components and rack accessories. It functions as a specialized front panel solution within their broader portfolio of electronic packaging hardware. The product line supports various industrial computing and communication infrastructure needs through standardized mechanical interfaces.
Public confirmed substitute part numbers are not available in the provided documentation.

What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More