20849213

Overview

The nVent Schroff part number 20849213 is a MicroTCA filler module designed for use in MTCA.1 and MTCA.4 compliant chassis systems. This specific unit is a single-slot, 2HP (Half-Height) filler panel constructed from 0.6 mm stainless steel. It serves as a blanking plate to fill unused slots within the carrier structure, ensuring proper airflow management and structural integrity. The component is engineered to be screwed into place, providing a secure fit within the rack environment.

Feature Summary

• Complies with MicroTCA.1 and MicroTCA.4 specifications
• Constructed from 0.6 mm stainless steel material
• Designed as a shielded filler module for slot coverage

Applications

• MicroTCA.1 carrier chassis slot filling
• MicroTCA.4 carrier chassis slot filling
• Rack equipment blanking for airflow management

Procurement Notes

Verify that the required quantity matches the supplier listing, as some distributors may package this item in sets of five pieces rather than individually. Confirm the mounting method aligns with your chassis screw patterns. Ensure the stainless steel construction meets your environmental corrosion resistance requirements before finalizing the order.

Selection Notes

Select this part when a blanking plate is needed for a single 2HP slot in a MicroTCA system. The stainless steel composition offers durability compared to plated alternatives. Ensure the chassis supports the specified 0.6 mm thickness for proper mechanical retention and alignment with adjacent modules.

Part Context

This filler module belongs to the nVent Schroff MicroTCA accessory family, which provides standardized components for telecom and industrial computing racks. These accessories ensure consistent form factors across different carrier manufacturers, facilitating interoperability and modular expansion in high-density electronic packaging environments.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Users should verify compatibility with existing chassis designs before attempting to source alternative filler panels from other manufacturers.