SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff part number 21130047 is a sleeve accessory designed for EuropacPRO subracks. It is constructed from polyamide material and features specific dimensional attributes including a height of 6 mm and a width of 6.8 mm. This component serves as a structural element within the EuropacPRO rack mounting system, providing necessary spacing or protection for installed modules.
Verify the exact manufacturer part number against official nVent Schroff documentation to ensure compatibility with the intended EuropacPRO subrack configuration. Confirm material specifications and dimensional requirements prior to procurement to avoid installation issues.
Select this component based on its specific design for EuropacPRO subracks. Ensure the polyamide construction meets environmental requirements. Verify that the 6 mm height and 6.8 mm width dimensions align with the mechanical constraints of the target application.
This item belongs to the nVent Schroff EuropacPRO accessories line, which provides modular components for 19-inch chassis and subrack systems. These accessories facilitate flexible configuration and secure mounting of electronic modules within industrial enclosures.
-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More