SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 21500037 is a cover plate designed for screw-fixing onto side panels. It features a panel width of 84 HP (horizontal pitch) and is specifically engineered for compatibility with the 235D 160/220D chassis series. This component functions as a front-panel closing or blanking plate, providing structural closure for rack mounting hardware applications within industrial enclosure systems.
Verify the manufacturer part number 21500037 against official nVent SCHROFF documentation to ensure correct identification. Confirm compatibility with the specific 235D 160/220D chassis variant required for your installation. Cross-reference technical datasheets for dimensional accuracy before procurement to avoid integration issues.
Select this component when a blanking plate is required for the specified chassis series. Ensure the 84 HP width matches the available rack space. Verify that the screw-fixing method aligns with the existing side panel configuration. Consider environmental factors if the enclosure operates in harsh industrial conditions.
This component belongs to the nVent SCHROFF range of rack mounting hardware and accessories. The brand specializes in enclosure and system technology for professional use in industry, research, and measurement technology. This specific item serves as a structural accessory rather than an active electronic component.
No public confirmed substitute part numbers are available in the provided documentation. Consult official nVent SCHROFF catalogs for equivalent blanking plates with compatible dimensions and mounting styles.

Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More