SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 22130025 is a side panel designed for the Varistar IP 55 and EMC-7035 series rack systems. It features a height of 1600 mm and a depth of 600 mm, constructed to provide electromagnetic compatibility (EMC) shielding and an IP 55 ingress protection rating. The component utilizes a screw-mounting method for secure attachment to the rack frame. It is finished in RAL color standard to match associated cabinet components, ensuring consistent aesthetic integration within industrial electronics enclosures.
Verify that the required mounting hardware is included or purchased separately, as datasheets often list panels without fasteners. Confirm the specific RAL color code matches existing cabinet components if replacement is needed. Ensure the rack frame profile is compatible with the specified screw-mounting pattern for the 1600H x 600D dimensions before ordering.
Select this part when both EMC shielding and IP 55 protection are simultaneously required for a rack side panel. The 1600 mm height and 600 mm depth define the physical footprint; ensure these dimensions align with the internal equipment layout. Consider the screw-mounting requirement versus clip-on alternatives based on vibration resistance needs in the application environment.
This component belongs to the nVent SCHROFF Varistar and EMC-7035 product families, which specialize in modular electronics packaging. These systems are engineered for high-density equipment mounting in telecommunications, power distribution, and industrial automation sectors. The side panel serves as a critical structural and protective element within these standardized rack architectures.
Direct substitutes must match the 1600H x 600D dimensions, IP 55 rating, and EMC shielding specifications. Verify compatibility with the specific rack frame model (e.g., EMC-7035) to ensure correct screw-hole alignment. Generic side panels lacking certified EMC performance or IP 55 sealing may not satisfy regulatory or environmental requirements.

Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More