SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 22130086 is a rack component manufactured by nVent SCHROFF, designed for integration into standard electronics enclosures and server cabinets. As part of the company's comprehensive range of packaging solutions, this specific item falls under the category of front panel components or chassis accessories intended to support modular and scalable system architectures. It contributes to the mechanical stability and organization of 19-inch rack installations.
Verify the exact technical specifications and dimensional drawings against official nVent SCHROFF documentation before procurement. Ensure compatibility with existing rack infrastructure. Confirm that the component meets required environmental and mechanical standards for the intended installation environment. Cross-reference the part number with current manufacturer catalogs to confirm availability and specification updates.
Select this component based on its compatibility with 19-inch rack standards and specific mechanical requirements. Evaluate the need for modular scalability within the enclosure design. Consider the material properties and mechanical stability provided by nVent SCHROFF products. Ensure the component fits the specific spatial constraints of the target chassis or cabinet assembly.
This component belongs to the nVent SCHROFF portfolio, a leader in electronics packaging design. The brand offers a wide range of innovative products including cabinets, subracks, backplanes, and PCB accessories. The 22130086 model is part of their systematic approach to providing combinable and modular solutions for embedded computer systems and general electronics needs.
Publicly confirmed substitute part numbers are not available in the provided source data. Consult official nVent SCHROFF documentation for equivalent components or updated series replacements.

Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More