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23LC512-I/SN is listed in the Memory IC range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SRAM 512KBIT SPI/QUAD 8SOIC. Review the specifications below when checking this part for your BOM.
The Microchip Technology 23LC512-I/SN is a 512-Kbit Serial Static Random Access Memory (SRAM) device. It features an SPI-compatible bus interface supporting standard, Dual I/O (SDI), and Quad I/O (SQI) modes with a maximum clock frequency of 20 MHz for the Industrial temperature grade. The memory organization is 64K x 8 bits. The device operates within a supply voltage range of 2.5V to 5.5V and supports an industrial ambient temperature range of -40°C to +85°C. It is housed in an 8-Lead Small Outline Integrated Circuit (SOIC) package.
Verify that the ordering suffix 'SN' corresponds specifically to the 8-lead SOIC package configuration. Confirm the 'I' suffix indicates compliance with the Industrial temperature range specifications (-40°C to +85°C). Ensure the component matches the exact 23LC512 part number rather than the 23A512 variant, which has different voltage requirements. Cross-reference the datasheet revision DS20005155C for accurate electrical characteristics.
Select this component when an SPI-compatible SRAM solution is required with a 512-Kbit capacity. The 23LC512-I/SN is suitable for designs operating between 2.5V and 5.5V, distinguishing it from the lower-voltage 23A512 series. Consider the SOIC package dimensions if board space constraints align with the 8-Lead Small Outline form factor. Verify that the host microcontroller supports the desired SPI mode or can emulate the protocol via firmware.
The 23LC512 belongs to the Microchip 23A512/23LC512 family of Serial SRAM devices. This family offers high reliability and low power consumption. The 23LC512 variant specifically targets applications requiring a wider supply voltage range compared to the 23A512. The 'I' designation denotes the Industrial temperature grade, while the 'SN' suffix identifies the specific plastic small outline package type used in surface-mount assemblies.
The 23LC512T-I/SN is a tape-and-reel version of the same device. The 23LC512-E/SN is available for extended temperature applications. Direct pin-to-pin replacements within the same package may include other 512-Kbit SPI SRAMs, but voltage and speed specifications must be verified against the source documentation.
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