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23LCV512-E/ST is listed in the Memory IC range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SRAM 512KBIT SPI/DUAL 8TSSOP. Review the specifications below when checking this part for your BOM.
The Microchip Technology 23LCV512-E/ST is a 512-Kbit Serial SRAM device housed in an 8-lead TSSOP package. It operates within a supply voltage range of 2.5V to 5.5V and supports an industrial temperature range of -40°C to +125°C. The device features a SPI-compatible bus interface with a maximum clock frequency of 20 MHz and supports SDI (Serial Dual Interface) mode for enhanced data rates. Memory organization is 64K x 8-bit, utilizing a 32-byte page structure. Key electrical characteristics include a read current of 3 mA at 5.5V and 20 MHz, and a standby current of 4 µA at +85°C.
Verify the 'E' suffix indicates extended temperature support up to +125°C against official datasheets. Confirm the '/ST' designation corresponds specifically to the 8-lead TSSOP package variant. Ensure compatibility with host system voltage levels within the 2.5V to 5.5V operating range. Check RoHS compliance status for environmental regulations.
Select this component when application requirements demand infinite endurance for write cycles, which distinguishes it from Flash or EEPROM alternatives. Consider the 23LCV512-E/ST if the design environment exceeds standard industrial limits (+85°C), necessitating the extended temperature rating. Evaluate the need for SDI mode if higher bandwidth than standard SPI is required for data transfer speeds.
This part belongs to the 23LCV512 family of serial SRAM devices manufactured by Microchip Technology. The family provides volatile memory solutions with battery backup capabilities. Variants typically differ by temperature grade (e.g., Industrial vs. Extended) and package type (SOIC, PDIP, TSSOP). The 23LCV512 series serves as a high-reliability alternative to traditional non-volatile memories in embedded systems.
Public confirmed substitute part numbers are not available in the provided documentation.
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