SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 24576086 is a rear cover component designed for the PROPAC series of rack enclosures. It is specified as a 3U height unit with a horizontal pitch of 42 HP (Hole Pitch). The component serves as a structural end-cap or rear panel for modular rack systems, ensuring enclosure integrity and compliance with standard mounting dimensions.
Verify that the target application utilizes the PROPAC series architecture, as this rear cover is specific to that product line. Confirm the required horizontal pitch is 42 HP to ensure mechanical compatibility with existing side rails and mounting hardware. Cross-reference the 3U height specification against the intended module depth and enclosure configuration to prevent fitment issues during assembly.
Select this component when finalizing the rear structure of a PROPAC rack system requiring a 42 HP width. Ensure the existing rack frame supports 3U vertical spacing. This part is strictly a passive structural element; it does not provide active electronic functions or integrated cooling mechanisms beyond basic enclosure sealing.
This component belongs to the nVent SCHROFF PROPAC family, which offers modular rack solutions for industrial electronics. The 24576086 variant addresses the need for standardized rear closure in compact 3U configurations, maintaining the series' consistency in hole pitch and dimensional tolerances for seamless integration with other PROPAC accessories.
No public confirmed substitute part numbers are available for this specific proprietary rear cover design.

Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More