SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 24813714 is a PRO multi ventilated plug-in unit designed for 19-inch rack systems. It features a 6U height and supports 14 HP (Horizontal Pitch) modules. The unit accepts boards in euroboard format, allowing PCBs to be mounted in an HP grid configuration. It includes extruded side panels on the right and left sides, equipped with grooves for secure board retention. This frame-type kit is intended for professional industrial, research, and measurement technology applications requiring modular electronic packaging solutions.
Verify the specific part number 24813714 against official nVent SCHROFF documentation to confirm compatibility with existing 19-inch rack frames. Ensure that the required 6U height and 14 HP width dimensions match your system constraints. Confirm that the euroboard format support aligns with your printed circuit board specifications before procurement.
Select this unit when a ventilated solution for euroboard formats is required within a 19-inch enclosure. Consider the 6U height and 14 HP capacity to ensure adequate space for your modules. Verify that the included side panels meet your mechanical retention needs without additional accessories.
This component belongs to the nVent SCHROFF PRO series of rack-mounted accessories. The brand specializes in enclosure and system technology for professional use. The product line focuses on modular, scalable, and combinable solutions for electronics packaging, including subracks, backplanes, and PCB accessories.
Consult official nVent SCHROFF cross-reference lists for verified substitutes. Generic equivalents may not match the precise 6U/14 HP dimensions or euroboard compatibility. Ensure any replacement maintains the same ventilation and mechanical retention characteristics.

Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More