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24LC08B-I/P is listed in the Memory IC range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC EEPROM 8KBIT I2C 400KHZ 8DIP. Review the specifications below when checking this part for your BOM.
The Microchip Technology 24LC08B-I/P is an 8-Kbit Electrically Erasable PROM (EEPROM) organized as four blocks of 256 x 8-bit memory. It operates with a single supply voltage ranging from 2.5V to 5.5V and supports a maximum clock frequency of 400 kHz via a 2-Wire Serial Interface compatible with I²C protocols. The device features a maximum access time of 900 ns, a standby current of 1 µA, and an operating temperature range of -40°C to +85°C. It utilizes an 8-Lead PDIP package.
Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C) and 'P' denotes the 8-Lead PDIP package. Confirm RoHS compliance status through official manufacturer documentation or authorized distributors prior to procurement. Ensure the ordering part number matches the required voltage and interface specifications exactly.
Select this component for applications requiring non-volatile data storage with I²C interface compatibility. The 2.5V minimum operating voltage distinguishes it from lower-voltage variants like the 24AA08. Consider the PDIP package for through-hole mounting requirements. Verify that the 400 kHz clock speed meets system timing constraints and that the 16-byte page buffer aligns with write efficiency needs.
This device belongs to the 24XX08 family of serial EEPROMs, which includes the 24AA08 and 24FC08 models. While sharing similar memory organization and interface protocols, the 24LC08B is specifically optimized for operation starting at 2.5V, unlike the 24AA08 which supports 1.7V. The family provides a standardized solution for low-pin-count, byte-addressable memory applications across various Microchip packaging options.
The 24LC08B-I/SN serves as a direct functional substitute offering identical electrical characteristics within the same temperature range, differing only in the SOIC surface-mount package format.
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