3-2041255-5

Edgeboard Connectors Overview

The 3-2041255-5 is a PCI Express card edge connector manufactured by TE Connectivity AMP Connectors. It features 98 positions with a female contact configuration and a 0.039-inch (1.00mm) pitch. The connector utilizes a straddle mount installation type and supports a card thickness of 0.091 inches (2.30mm). Contact surfaces are gold-plated to a thickness of 30 microinches (0.76 micrometers). The housing is constructed from black glass-filled polyamide 9T, ensuring stability across an operating temperature range of -40°C to 85°C.

Edgeboard Connectors Feature Summary

• Straddle mount design for secure board attachment
• Gold-plated cantilever contacts for reliable signal transmission
• Glass-filled polyamide insulation for thermal stability

Edgeboard Connectors Applications

• PCI Express peripheral cards
• High-speed data interface modules
• Industrial computing backplanes

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm plating thickness and material specifications. Ensure compatibility with the target PCB footprint and mating card dimensions before procurement. Confirm RoHS compliance status if required by project regulations.

Edgeboard Connectors Selection Notes

Select this component when a 98-position PCI Express interface with straddle mounting is required. The 1.00mm pitch accommodates standard high-density interconnects. Verify that the mating card thickness aligns with the 2.30mm specification to ensure proper mechanical engagement and electrical continuity.

Edgeboard Connectors Part Context

This part belongs to the PCI Express card edge connector family designed for high-reliability applications. It serves as a critical interface between expansion cards and system backplanes, supporting data transfer protocols defined by the PCI-SIG standards within industrial and commercial electronic systems.

Edgeboard Connectors Replacement Considerations

The 2-2041255-5 is a confirmed substitute offering identical positioning but with different plating thickness specifications. Verify functional equivalence regarding contact resistance and mechanical retention before substitution.