SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 30118346 is an aluminium front panel from the 30118 Series, designed for rack enclosure integration. It measures 128.4 mm in height and 19.98 mm in width. The component is non-shielded and features cut-outs for two Sub-D connectors with 25-pin configurations. Constructed from aluminium, it serves as a flat accessory to provide connectivity access within equipment racks.
Verify that the required connector configuration matches the dual 25-pin Sub-D layout specified for part number 30118346. Confirm dimensional compatibility with the target rack system, ensuring the 128.4 mm height and 19.98 mm width fit the designated opening. Ensure the application does not require electromagnetic shielding, as this unit is explicitly non-shielded.
Select this model when a flat aluminium panel with specific dual 25-pin D-Sub cut-outs is required. Compare against other 30118 series variants which may offer different pin counts or shielded options. Ensure the physical dimensions align with the existing rack infrastructure before procurement.
This component belongs to the nVent SCHROFF 30118 Series of aluminium front panels. These panels are standardized accessories used to complete rack enclosures, providing necessary interfaces for external connections while maintaining a uniform aesthetic and structural integrity within industrial or IT rack systems.
Direct substitutes within the same series include part numbers 30118345 (2x 15-pin) and 30118347 (3x 9-pin). Verify pin count requirements carefully, as these variants differ in connector configuration.

Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More