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305-016-500-512 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 16POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-016-500-512 is a standard card edge connector featuring 16 positions arranged in a dual row configuration. It utilizes a 3.96 mm (0.156 inch) contact pitch with a 3.56 mm (0.140 inch) row spacing. Designed for .062 inch (1.57 mm) nominal thickness printed circuit boards, this header employs gold-plated copper alloy contacts and a green thermoplastic insulator body. The unit supports a current rating of 5 A and offers vertical panel mount installation with solder lug termination.
Verify the specific suffix codes against official EDAC documentation to confirm exact termination type and plating specifications. Ensure compatibility with the target PCB thickness of 1.57 mm before procurement. Confirm that the vertical panel mount orientation aligns with the mechanical assembly requirements. Cross-reference the 16-position count with the schematic to prevent mismatched interface designs during component sourcing.
Select this component when a dual-row card edge connector with a 3.96 mm pitch is required for .062 inch thick boards. The 5 A current rating suits moderate power distribution needs within the connector interface. Consider the vertical panel mount style if space constraints prohibit horizontal layouts. Verify that the solder lug termination method matches the available manufacturing processes for the final assembly line.
This part belongs to the EDAC 305 series of standard card edge connectors. The series is characterized by its consistent 3.96 mm contact spacing across various position counts. The 305 series headers are engineered for durability and reliable performance in demanding electronic environments, offering a standardized solution for interconnecting circuit boards through edge-mounted interfaces.
No public confirmed substitute part numbers are available in the provided documentation.
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