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305-020-521-204 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 20POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-020-521-204 is a standard card edge connector header from the 305 series, featuring a dual-row configuration with 20 positions. It utilizes a 3.96 mm (0.156 inch) contact spacing and a 3.56 mm row spacing. Designed for panel mount installation at a vertical angle, it accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The contacts are constructed from copper alloy with gold plating, rated for 5 A current. Termination is achieved via solder pins, and the insulator body is made of thermoplastic polyester.
Verify the specific ordering suffix against the manufacturer datasheet to confirm exact termination style, contact plating thickness, and mounting hardware requirements. Ensure compatibility with the target PCB edge guide dimensions and panel cutout specifications before procurement. Confirm RoHS compliance status if required by project regulations.
Select this component when a dual-row vertical header is required for 0.062 inch thick circuit boards. The 3.96 mm pitch suits applications needing robust mechanical retention without excessive height. Verify that the 5 A current rating aligns with the electrical load requirements of the connected traces.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting styles, all sharing common dimensional standards for board thickness and contact spacing. It serves as a standardized solution for connecting edge-card modules to base systems in industrial and commercial electronics.
Cross-reference with other EDAC 305 series headers having identical 20-position dual-row layouts. Verify that substitute parts match the 3.96 mm pitch and 1.57 mm board thickness tolerance. Ensure equivalent termination methods and material compositions for direct interchangeability.
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