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307-040-427-158 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FML 40POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 307-040-427-158 is a standard card edge connector from the 307 series, designed for reliable signal transmission in electronic assemblies. This single-row receptacle features 40 positions with a 3.96 mm (0.156 inch) pitch. It utilizes gold-plated copper alloy contacts and a thermoplastic polyester housing. The component supports panel mount installation at a vertical angle, accommodating PCBs with a thickness of 1.57 mm. Rated for 5 A current, it operates within a temperature range of -40°C to +105°C.
Verify the specific suffix 158 against official EDAC documentation to confirm material specifications and plating details. Ensure compatibility with the target PCB thickness of 1.57 mm and verify that the vertical panel mount style aligns with the mechanical enclosure design requirements before finalizing procurement.
Select this model when a single-row connection with a 3.96 mm pitch is required for vertical panel mounting. The 40-position count suits applications needing moderate I/O density. Confirm that the 5 A current rating and operating temperature range meet the environmental conditions of the intended deployment scenario.
This component belongs to the EDAC 307 series of standard card edge connectors. The series offers various position counts and mounting styles, providing a modular solution for board-to-board or board-to-panel interconnections. The 307-040-427-158 variant specifically addresses needs for high-density single-row interfaces with robust mechanical retention.
Compatible substitutes within the same series include part numbers such as 307-040-427-102 and 307-040-427-203. These alternatives share identical pitch and position counts but may differ in termination type or housing color. Verify mechanical fit and electrical ratings before substitution.
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