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316-91-146-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN SOCKET 46POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 316-91-146-41-001000 is a 46-position elevated IC socket designed for through-hole mounting. It features a dual-row DIP configuration with a 0.100-inch (2.54mm) contact spacing and row pitch. The connector utilizes gold-plated contacts on copper alloy terminals, ensuring reliable signal transmission. Rated for 3A current, it operates within a temperature range of -55°C to 125°C. The housing is constructed from black PCT material, providing structural integrity and environmental resistance for precision interconnect applications.
Verify the specific pin count and row configuration against schematic requirements before ordering. Confirm that the elevated height aligns with mechanical constraints in the assembly. Ensure compatibility with the target IC package dimensions to prevent insertion stress. Cross-reference the manufacturer's latest datasheet for any updates to material specifications or compliance status prior to final procurement decisions.
Select this model when an elevated profile is required to accommodate underlying components or facilitate automated handling. The 46-position capacity suits complex integrated circuits requiring extensive I/O connections. Consider the through-hole mounting style for robust mechanical retention compared to surface-mount alternatives. Evaluate the operating temperature range to ensure suitability for the intended environmental conditions.
This component belongs to the Mill-Max 316 series of precision interconnect sockets. The series is characterized by high-reliability construction suitable for demanding electronic environments. As a specialized interconnect solution, it complements standard DIP sockets by offering enhanced mechanical positioning and durability for critical circuit interfaces.
Direct substitutes must match the 46-pin count, 0.100-inch spacing, and elevated form factor. Verify that alternative models maintain identical through-hole termination and gold plating specifications. Ensure thermal ratings and housing materials are compatible with existing assembly processes.
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