SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 34562757 is an X-chassis plate designed for rack mounting applications. It features a depth of 340 mm and supports a horizontal pitch of 28 HP. This component serves as a structural element within the Schroff ecosystem, providing a mounting surface or chassis interface for electronic assemblies.
Verify the exact material composition and finish specifications against the official datasheet before procurement. Confirm compatibility with existing rack standards and ensure the 340 mm depth aligns with system requirements. Cross-reference the manufacturer part number to avoid substitution errors.
Select this component when a 340 mm deep chassis plate with 28 HP pitch is required. Ensure the mechanical interface matches the intended mounting hardware. Evaluate space constraints within the rack to accommodate the specified depth without interference.
This part belongs to the nVent SCHROFF range of rack accessories and chassis components. It is designed to complement other rack elements, facilitating organized and secure installation of electronic modules within standardized enclosure systems.
No public confirmed substitute part numbers are available for this specific component. Verify dimensional and functional equivalence if considering alternatives from other manufacturers.

Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More