351-10-138-00-005000

Headers, Male Pins Overview

The Mill-Max 351-10-138-00-005000 is a vertical pin header connector designed for through-hole mounting. It features 38 positions with a 2.54 mm (0.100 inch) pitch. The connector utilizes round male pins with tin plating and is constructed with a black polybutylene terephthalate (PBT) insulator rated UL94 V-0. It operates within a temperature range of -55°C to 125°C and supports a current rating of 3A per contact.

Headers, Male Pins Feature Summary

• Vertical pin header configuration for standard board mounting
• Precision-machined contacts with durable tin plating
• High-temperature resistant PBT insulation material

Headers, Male Pins Applications

• General-purpose electronic interconnects
• Industrial control systems
• Telecommunications equipment

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix against official Mill-Max documentation to ensure correct pin count, plating thickness, and packaging specifications. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer prior to procurement.

Headers, Male Pins Selection Notes

Select this component when a standard 2.54 mm pitch vertical header is required for through-hole assembly. Ensure the mating device accommodates the specified 38-position layout and that the operating environment remains within the -55°C to 125°C thermal limits defined by the PBT insulation.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 351 series, which provides reliable precision-machined interconnect solutions. The series is characterized by high durability and consistent electrical performance, serving as a fundamental component in various electronic assemblies requiring robust mechanical and electrical connections.

Headers, Male Pins Replacement Considerations

Direct substitutes include other Mill-Max headers with identical 38-position counts and 2.54 mm pitch, such as the 351-10-138-00-001000 variant, provided the specific plating and packaging requirements match the application needs.