416-41-232-41-006000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 416-41-232-41-006000 is a single-row IC socket designed for through-hole mounting. It features 32 positions with a 0.100-inch (2.54mm) pin spacing. The connector utilizes gold-plated contacts and standard solder tail termination. This component belongs to the 416 series, providing a reliable interface for integrated circuits in electronic assemblies.

Headers, Receptacles, Female Sockets Feature Summary

• Single-row configuration for compact circuit board integration
• Gold-plated contact surfaces for enhanced conductivity
• Through-hole solder tail termination method

Headers, Receptacles, Female Sockets Applications

• Integrated circuit device sockets
• Standard solder tail applications
• Electronic assembly interconnects

Headers, Receptacles, Female Sockets Procurement Notes

Verify current availability status as supply may be restricted or limited. Confirm specific ordering requirements directly with the manufacturer or authorized distributors before finalizing procurement plans. Ensure compatibility with existing design specifications.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a 32-position single-row socket is required. Verify that the 0.100-inch pitch matches the target IC footprint. Ensure the through-hole solder tail style aligns with the printed circuit board manufacturing process and mechanical constraints of the enclosure.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 416 series, which specializes in IC and component sockets. The series offers various pin counts and configurations tailored for high-reliability interconnect needs. Mill-Max Manufacturing Corp produces these precision-machined components globally.

Headers, Receptacles, Female Sockets Replacement Considerations

Consult cross-reference tools for parametrically similar parts. Verify that any substitute maintains identical pin count, pitch, and termination style to ensure functional compatibility without redesigning the host circuit board.