Headers, Male Pins 435-10-206-00-160000 product image

435-10-206-00-160000

$4.95
  • Description:CONN HEADER VERT 6POS 2.54MM
  • Series:435
  • Mfr:Mill-Max Manufacturing Corp.
  • Package:Tube

SKU:c6c071c9dcbc Category: Brand:

  
  • Quantity
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435-10-206-00-160000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER VERT 6POS 2.54MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for 435-10-206-00-160000

  • Description:CONN HEADER VERT 6POS 2.54MM
  • Series:435
  • Mfr:Mill-Max Manufacturing Corp.
  • Package:Tube
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.100" (2.54mm)
  • Number of Positions:6
  • Number of Rows:2
  • Row Spacing - Mating:0.100" (2.54mm)
  • Number of Positions Loaded:All
  • Style:Board to Board
  • Shrouding:Unshrouded
  • Mounting Type:Through Hole
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Length - Mating:0.125" (3.18mm)
  • Contact Length - Post:0.104" (2.64mm)
  • Overall Contact Length:0.299" (7.60mm)
  • Insulation Height:0.050" (1.27mm)
  • Contact Shape:Circular
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Finish - Post:Gold
  • Contact Material:Brass Alloy
  • Insulation Material:Polycyclohexylenedimethylene Terephthalate (PCT)
  • Features:-
  • Operating Temperature:-
  • Ingress Protection:-
  • Material Flammability Rating:-
  • Insulation Color:Black
  • Current Rating (Amps):-
  • Voltage Rating:-

Headers, Male Pins datasheet and documents for 435-10-206-00-160000

435-10-206-00-160000

Headers, Male Pins Overview

The Mill-Max 435-10-206-00-160000 is a standard pin header connector designed for board-to-board interconnection. It features six contacts arranged in two rows with a vertical orientation and a 2.54mm (0.100 inch) pitch. The component utilizes straight male pins intended for through-hole solder termination. Constructed as a rigid PCB header, it provides reliable electrical connectivity for standard electronic assemblies requiring fixed positional alignment between circuit boards.

Headers, Male Pins Feature Summary

  • Six-contact configuration organized in a dual-row layout
  • Vertical mounting design for direct board attachment
  • Standard pin header construction for stable mechanical support

Headers, Male Pins Applications

  • Board-to-board interconnect systems
  • General purpose electronic assembly integration
  • Rigid PCB stacking applications

Headers, Male Pins Procurement Notes

Verify the specific contact count and row configuration against schematic requirements. Confirm that the vertical orientation matches the enclosure constraints. Ensure the through-hole soldering process aligns with the manufacturing capabilities of the target printed circuit board to maintain proper mechanical retention and electrical continuity during operation.

Headers, Male Pins Selection Notes

Select this component when a fixed, non-flexible connection between two parallel circuit boards is required. The vertical form factor suits applications where space above the board is available but lateral clearance is limited. Consider the rigid nature of the header for environments subject to moderate mechanical stress without dynamic movement requirements.

Headers, Male Pins Part Context

This part belongs to the Mill-Max standard pin header family, which focuses on high-reliability precision-machined interconnect components. The series is recognized for providing consistent performance in general electronic applications. Mill-Max Manufacturing Corp. has established a reputation for producing durable connectors that meet strict dimensional tolerances for industrial and commercial electronics.

Headers, Male Pins Replacement Considerations

Substitutes must match the 6-position count, 2-row arrangement, and 2.54mm pitch. Verify that alternative headers maintain the same vertical height and through-hole termination style to ensure physical compatibility with existing board layouts and assembly processes.

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