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435-10-210-00-160000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER VERT 10POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max Manufacturing Corp. model 435-10-210-00-160000 is a connector header designed for through-hole mounting. It features 16 positions arranged in a double row configuration with a 0.100-inch (2.54mm) pitch. The contacts are gold-plated to ensure reliable conductivity and corrosion resistance. This component serves as a standard pin header for electronic interconnect applications requiring robust mechanical stability.
Verify the specific ordering suffix against the manufacturer's official catalog to confirm exact plating thickness, material composition, and packaging quantity. Ensure the selected variant matches the required current rating and temperature specifications for the intended application environment before finalizing procurement orders.
Select this component when a double-row male header with a 0.100-inch pitch is required for PCB assembly. Consider the through-hole mounting style for applications needing high mechanical strength. Evaluate the gold plating requirements for long-term reliability in corrosive environments compared to tin alternatives.
This part belongs to the Mill-Max standard pin header series, which provides versatile interconnect solutions for various electronic industries. The 435 series specifically offers double-row configurations suitable for dense circuit layouts. Mill-Max manufactures these components using precision machining techniques to ensure consistent dimensional accuracy and electrical performance across production batches.
Cross-reference compatible headers from other manufacturers offering identical 16-position double-row specifications with matching 0.100-inch pitch dimensions. Verify that substitute parts maintain equivalent through-hole termination capabilities and comparable contact plating materials to ensure functional interchangeability without redesigning the host printed circuit board.
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