Memory IC 71321LA20PFG8 product image

71321LA20PFG8

$19.86
  • Description:IC SRAM 16KBIT PARALLEL 64TQFP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)

SKU:b31c25b2a3df Category: Brand:

  
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71321LA20PFG8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 16KBIT PARALLEL 64TQFP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 71321LA20PFG8

  • Description:IC SRAM 16KBIT PARALLEL 64TQFP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Asynchronous
  • Memory Size:16Kbit
  • Memory Organization:2K x 8
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:20ns
  • Voltage - Supply:4.5V ~ 5.5V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LQFP
  • Supplier Device Package:64-TQFP (14x14)
  • Access Time:20 ns

Memory IC datasheet and documents for 71321LA20PFG8

71321LA20PFG8

Memory IC Overview

The Renesas Electronics Corporation 71321LA20PFG8 is a high-speed, asynchronous dual-port static random-access memory (SRAM) with a storage capacity of 16Kb organized as 2K x 8 bits. It features a parallel interface and operates within a supply voltage range of 4.5V to 5.5V. The component provides an access time of 20 ns and supports battery backup operation for data retention down to 2V. It is housed in a 64-pin TQFP package with dimensions of 14x14 mm and functions within an operating temperature range of 0°C to 70°C.

Memory IC Feature Summary

  • True dual-ported memory cells enable simultaneous independent access to the same memory location from both ports without conflict.
  • Integrated interrupt logic provides two internal flags for direct port-to-port communication and synchronization.
  • On-chip arbitration logic manages bus access, utilizing BUSY output flags to prevent data collisions during concurrent operations.
  • Automatic power-down mode controlled by chip select inputs reduces standby power consumption significantly.

Memory IC Applications

  • Interprocessor communication links requiring low-latency data exchange between microprocessors.
  • Master/Slave dual-port RAM configurations expanding data bus width to 16 bits or more when paired with compatible slave devices.
  • Real-time data buffering in embedded systems where simultaneous read/write operations are critical.
  • Battery-backed memory applications requiring data retention at reduced supply voltages.

Memory IC Procurement Notes

Verify RoHS3 compliance status and confirm moisture sensitivity level (MSL 3) handling requirements before assembly. Ensure the design accommodates the specified 4.5V to 5.5V supply range and 0°C to 70°C operating temperature. Cross-reference pinouts and electrical characteristics against the official datasheet to validate compatibility with existing circuitry.

Memory IC Selection Notes

Select this component for designs requiring true dual-port functionality with integrated interrupt signaling. It serves as a suitable replacement for obsolete variants like the 71321SA series. Consider the 64-TQFP package constraints and verify that the 20 ns access time meets system timing requirements. Evaluate power consumption profiles against available alternatives if lower current draw is necessary.

Memory IC Part Context

This device belongs to the 71321LA family of dual-port SRAMs manufactured by Renesas Electronics. It succeeds earlier iterations such as the 71321SA, offering updated manufacturing processes and compliance standards. The LA suffix indicates industrial-grade temperature ranges and specific power management features compared to military or commercial variants.

Memory IC Replacement Considerations

The 71321SA20PF8 is listed as an obsolete predecessor; however, it lacks RoHS3 compliance and may differ in packaging details. Verify functional equivalence carefully before substitution. No other direct substitutes are confirmed in public documentation.

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