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7133LA35PF is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 32KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 7133LA35PF is a high-speed, asynchronous dual-port static random-access memory (SRAM) integrated circuit. It features a storage capacity of 32 kilobits organized as 2K words by 16 bits. The device supports parallel interface operations with a maximum access time of 35 nanoseconds. It operates on a single 5V power supply within the voltage range of 4.5V to 5.5V. The component is housed in a 100-pin Thin Quad Flat Package (TQFP) designed for surface-mount technology applications.
Verify the specific suffix designation against official manufacturer documentation to confirm package type and temperature rating. Confirm RoHS compliance status and lead finish specifications prior to integration. Check for end-of-life notifications or production change notices that may affect long-term availability. Ensure the ordering part number matches the required pinout and electrical characteristics exactly.
Select this component when a system requires independent read/write access to shared memory without external arbitration hardware. The 35ns speed grade suits moderate-to-high frequency asynchronous interfaces. Consider the 100-pin TQFP footprint for PCB layout constraints. Evaluate power requirements against the active and standby specifications provided in the datasheet.
This device belongs to the IDT 7133SA/LA series of dual-port SRAMs manufactured by Renesas Electronics. The 'LA' suffix typically denotes commercial temperature range variants compared to military-grade 'SA' counterparts. This family provides versatile memory solutions for complex embedded systems requiring high bandwidth and low latency data sharing between multiple masters.
Publicly confirmed substitute part numbers include 7133LA20PFG and 7133LA25PFGI8. Verify compatibility regarding access speed, package dimensions, and operating temperature ranges before substitution.
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