71V016SA10BF8

Memory IC Overview

The Renesas Electronics 71V016SA10BF8 is an asynchronous static random-access memory (SRAM) integrated circuit with a total storage capacity of 1 Mbit. The device features a memory organization of 64K words by 16 bits, accessed via a parallel interface. It operates within a supply voltage range of 3.15 V to 3.6 V and supports a maximum power supply current of 160 mA. The component provides a maximum random access time of 10 ns and is housed in a 48-pin CABGA package designed for surface-mount technology applications.

Memory IC Feature Summary

• Asynchronous parallel interface architecture for standard data transfer operations
• Single data rate (SDR) memory technology supporting volatile data retention
• Surface-mount installation style compatible with automated assembly processes

Memory IC Applications

• General-purpose embedded memory systems requiring fast random access
• Industrial control units utilizing surface-mount packaging constraints
• Consumer electronics devices operating within standard commercial temperature ranges

Memory IC Procurement Notes

Verify the specific revision level and RoHS compliance status directly with the manufacturer or authorized distributors, as datasheet details may vary. Confirm that the 48-pin CABGA package dimensions match the target PCB footprint requirements. Ensure that the 3.15 V to 3.6 V supply voltage specifications align with the system power design before integration.

Memory IC Selection Notes

Select this component when a 64K x 16 bit configuration is required with a 10 ns access speed. The 48-pin CABGA package is suitable for designs prioritizing compact surface-mount layouts over through-hole alternatives. Consider the 160 mA maximum current draw during power budget calculations to ensure adequate thermal management and supply stability.

Memory IC Part Context

This part belongs to the IDT71V016 series of asynchronous SRAMs manufactured by Renesas Electronics. The series typically offers various access speeds and package options to accommodate different performance and form-factor requirements in memory-intensive electronic applications.

Memory IC Replacement Considerations

Cross-reference with other parts in the 71V016SA10 family, such as the 71V016SA10PHG8 or 71V016SA10YI, ensuring pin compatibility and electrical parameter alignment. Verify package equivalence between CABGA and alternative formats like TSOP or SOJ if physical mounting changes are permissible.