71V2576YS150PFG

Memory IC Overview

The IDT 71V2576YS150PFG is a high-speed Synchronous Single Data Rate (SDR) Static Random-Access Memory (SRAM) integrated circuit. It features a memory density of 4.5 Mbit, organized as 128K words by 36 bits. The device supports a maximum clock frequency of 150 MHz with a clock access time of 3.8 ns. It utilizes a parallel interface and operates on a 3.3V core power supply. The component is housed in a 100-pin Thin Quad Flatpack (TQFP) package.

Memory IC Feature Summary

• Supports high system speed with 150 MHz clock frequency and 3.8 ns access time
• Features pipelined outputs for fully synchronous operation
• Includes burst counter logic for interleaved or linear burst modes
• Provides self-timed write cycles with global write control

Memory IC Applications

• High-performance computing systems requiring fast data buffering
• Network infrastructure equipment utilizing parallel SRAM interfaces
• Industrial control systems needing reliable synchronous memory solutions

Memory IC Procurement Notes

Verify the specific suffix 'PFG' to confirm the 100-TQFP plastic package configuration. Ensure compatibility with 3.3V I/O levels if interfacing with non-3.3V logic. Confirm RoHS compliance status for the specific manufacturing lot. Check for any product discontinuance notices or last-buy deadlines associated with this IDT part number before finalizing procurement plans.

Memory IC Selection Notes

Select this component when a 4.5 Mbit capacity with 36-bit word width is required. Choose this part over asynchronous SRAMs for applications demanding precise clock-synchronized data transfers. Consider the 100-pin TQFP package constraints regarding board space and thermal dissipation. Verify that the 150 MHz performance meets the system timing requirements compared to slower variants like the -133MHz option.

Memory IC Part Context

This part belongs to the IDT 71V2576S/71V2578S family of 3.3V Synchronous SRAMs. These devices are designed to eliminate dead bus cycles between read and write operations. The family typically includes variations in access speeds and package types, such as BGA options, while maintaining the same core memory architecture and burst mode capabilities.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for this specific component were not identified in the provided documentation.