71V3556SA166BQG8

Memory IC Overview

The 71V3556SA166BQG8 is a synchronous static random access memory (SRAM) integrated circuit manufactured by Renesas Electronics. It features a storage capacity of 4 Mbit organized as 128K x 36 bits. The device supports a maximum clock frequency of 166 MHz with an access time of 3.5 ns. It operates within a supply voltage range of 3.135 V to 3.465 V and has a maximum power current of 360 mA. The component utilizes a parallel interface and is housed in a 165-CABGA package suitable for surface mount technology.

Memory IC Feature Summary

• Synchronous Single Data Rate (SDR) architecture with Slow ZBT characteristics
• High-speed parallel data interface supporting up to 166 MHz operation
• Integrated error correction capabilities via built-in ECC logic

Memory IC Applications

• Network infrastructure equipment requiring high-bandwidth memory
• Telecommunications systems utilizing fast data processing
• Industrial control systems needing reliable volatile storage

Memory IC Procurement Notes

Verify the specific suffix BQG8 against official Renesas documentation to confirm package type and moisture sensitivity level. Ensure compatibility with existing PCB footprints for the 165-CABGA configuration. Confirm lead-free status and RoHS compliance requirements prior to ordering. Check for any recent product change notices affecting pinout or electrical specifications.

Memory IC Selection Notes

Select this component when a 128K x 36 organization is required for synchronous memory applications. The 166 MHz speed grade suits designs demanding low latency and high throughput. Consider the 3.3V I/O compatibility with standard logic families. Evaluate the thermal performance within the specified operating temperature range for the target environment.

Memory IC Part Context

This part belongs to the 71V3556SA series of synchronous SRAMs from Renesas. It is designed for high-performance embedded applications where fast access times are critical. The series typically includes variants with different speed grades and packaging options to accommodate various system design constraints and form factors.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for this specific model were not identified in the provided source material.