71V3558S133PFI

Memory IC Overview

The IDT71V3558S133PFI is a 4.5 Mbit synchronous ZBT SRAM organized as 256K x 18, operating at a maximum clock frequency of 133 MHz with a 4.2 ns access time. It utilizes a 3.3 V core supply and features pipelined outputs with a burst counter for single-cycle deselect. The device is housed in a 100-pin TQFP package and supports both interleaved and linear burst modes.

Memory IC Feature Summary

• Supports high-performance system speeds up to 133 MHz with zero wait-state operation between read and write cycles.
• Features internally synchronized output buffer enable to eliminate external OE control requirements.
• Provides four-word burst capability with selectable interleaved or linear address sequences via an internal burst counter.

Memory IC Applications

• High-speed data buffering in telecommunications equipment
• Cache memory implementation in network routers and switches
• Digital signal processing systems requiring low-latency access

Memory IC Procurement Notes

Verify the specific suffix 'XS' against the requested model, as datasheets indicate 'XS' variants are standard for this speed grade. Confirm RoHS compliance status, as older PFI packages may differ from newer G8 versions. Check component obsolescence status and lead times due to potential discontinuation by Renesas.

Memory IC Selection Notes

Select this part for applications requiring 18-bit data width and synchronous interface compatibility. Ensure the design accommodates the 100-TQFP footprint and 3.3 V logic levels. Consider alternative speed grades if higher throughput is needed, or verify pinout compatibility with existing PCB layouts.

Memory IC Part Context

This component belongs to the IDT71V3556/58 family of 3.3 V Synchronous ZBT SRAMs. The family includes 128K x 36 and 256K x 18 configurations. These devices are designed for high-speed embedded systems where deterministic latency and high bandwidth are critical performance factors.

Memory IC Replacement Considerations

IDT71V3558XS133PF8 is a verified equivalent offering the same electrical specifications in a tape-and-reel package instead of tray packaging. Verify mechanical dimensions and moisture sensitivity levels before substitution.