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74F175DC is listed in the Flip Flops range at ChipApex. The manufacturer field lists Rochester Electronics, LLC. Its product description is F/FAST SERIES, 1 FUNC, POSITIVE. Review the specifications below when checking this part for your BOM.
The 74F175DC is a D Flip-Flop belonging to the F/FAST series, manufactured by Rochester Electronics. It features one function with four bits of data processing capability. The device utilizes positive edge triggering for clock synchronization and provides complementary outputs. Constructed using TTL technology, it is housed in a ceramic dual in-line package (CDIP) with sixteen terminals. The component operates within a temperature range of -55 °C to 125 °C.
Verify manufacturer documentation to confirm specific lot traceability and quality assurance standards associated with Rochester Electronics distribution channels. Ensure that the ceramic package integrity meets required environmental specifications for the intended operational conditions. Cross-reference part markings against official datasheets to validate authenticity before integration into critical systems.
Select this component when high-speed switching and reliability are paramount. The F/FAST series offers superior speed compared to standard logic families. The ceramic package provides enhanced protection against moisture and mechanical stress. Complementary outputs simplify circuit design by eliminating external inverters. Consider thermal management requirements due to the wide operating temperature range.
This device is part of the broader 74F175 family of quad D-type flip-flops. It shares functional compatibility with other manufacturers' equivalents while adhering to standard logic pinouts. Rochester Electronics specializes in sourcing and distributing obsolete and hard-to-find components, ensuring supply continuity for legacy designs requiring this specific high-speed TTL technology.
Equivalent parts include SN74F175N from Texas Instruments and MC74F175N from ON Semiconductor. Verify voltage levels and output drive capabilities when substituting. Ensure package dimensions match if board space is constrained.
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