87409-110LF

Headers, Male Pins Overview

The Amphenol ICC (FCI) 87409-110LF is a high-density, low-profile board-to-board connector system designed for space-constrained electronic applications. It features a 0.5mm pitch and a mating height of 1.2mm, supporting up to 110 positions in a single row configuration. The connector utilizes a gold-plated contact finish to ensure reliable signal transmission and corrosion resistance. Designed for surface mount technology, it offers robust mechanical stability with a locking mechanism that secures the mate during operation. The housing is constructed from thermoplastic material rated for high thermal performance.

Headers, Male Pins Feature Summary

• Ultra-low profile design suitable for thin form factor devices
• High-density 0.5mm pitch enables maximum I/O in minimal area
• Secure locking mechanism ensures stable connection integrity
• Gold-plated contacts provide durable electrical performance

Headers, Male Pins Applications

• Mobile communication devices
• Portable consumer electronics
• Medical instrumentation
• Automotive infotainment systems

Headers, Male Pins Procurement Notes

Verify the specific reel quantity and tape-and-reel specifications required for your assembly line equipment. Confirm that the ordering suffix matches the desired contact plating thickness and housing color if applicable. Ensure compatibility with standard SMT reflow profiles as defined in the official datasheet. Check for any specific handling instructions regarding ESD sensitivity during storage and installation processes.

Headers, Male Pins Selection Notes

Evaluate the available pin counts to determine if the 110-position variant meets the circuit requirements without excessive unused space. Consider the mating cycle durability if the application involves frequent disconnection. Assess the thermal resistance capabilities against the operating environment of the final device. Compare the overall footprint dimensions against the PCB layout constraints to ensure proper clearance around adjacent components.

Headers, Male Pins Part Context

This component belongs to the high-density interconnect family focused on miniaturization. It complements other low-profile solutions by offering increased pin density within a constrained vertical space. The series is engineered for modern electronics where size reduction is critical without compromising signal integrity or mechanical reliability standards.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 0.5mm pitch, 110 positions, and 1.2mm height specifications. Verify that alternative connectors support the same surface mount termination style and locking mechanism type. Cross-reference the footprint dimensions to ensure PCB compatibility before switching suppliers.