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88W9098-A2-NYGC/MP is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC RF 88HVQFN. Review the specifications below when checking this part for your BOM.
The NXP 88W9098 is a Wi-Fi 6 and Bluetooth 5.3 combo SoC supporting concurrent dual 2x2 operation on 2.4/5 GHz bands. It implements IEEE 802.11ax/ac with 1024 QAM, DL/UL OFDMA, MU-MIMO, Target Wake Time, and Zero Wait DFS. Bluetooth features include LE Long Range and Class 1.5/2 support. Host interfaces include PCIe 2.0, SDIO 3.0, UART, and USB 3. Operating temperatures range from -40°C to +85°C (Industrial) and 0°C to +70°C (Commercial).
Verify the specific suffix against official documentation to confirm interface configuration and temperature grade. Module partners may offer variants with different antenna types or form factors. Ensure host system supports required interfaces like PCIe 2.0 or SDIO 3.0. Confirm regional certifications match target deployment markets.
Select this SoC for applications demanding Wi-Fi 6 throughput and low latency alongside Bluetooth 5.3. Consider industrial temperature ranges for harsh environments. Evaluate host interface availability, as the chip supports multiple options including PCIe, SDIO, and USB. Check module partner offerings for size constraints.
Part of NXP's 88W90xx series focusing on Wi-Fi 6 and Bluetooth 5.3 integration. Designed for high-reliability IoT and industrial markets. Offers gigabit-level performance with enhanced security features compared to previous generation solutions.
Public confirmed substitutes include 88W8997 and 88Q9098. Verify compatibility with existing host interfaces and firmware requirements before substitution.
Yes, it features an innovative concurrent dual Wi-Fi and dual-mode Bluetooth 5.3 architecture.
It supports 20 MHz, 40 MHz, and 80 MHz channel bandwidths.
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