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895-084-555-203 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 84POS 0.100. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 895-084-555-203 is a dual-edge female card edge connector with 84 positions arranged in two rows of 42 contacts each. It features a 0.100-inch (2.54 mm) contact spacing and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). The connector utilizes gold-plated copper alloy contacts housed in a black polyphenylene sulfide (PPS) insulator body. Designed for through-hole mounting, it supports solder termination and operates within a temperature range of -40°C to +125°C.
Verify the specific ordering suffix against the manufacturer's official 895 Series Ordering Guide to confirm compatibility with required board thicknesses and mounting styles. Ensure that the selected variant matches the necessary environmental certifications, such as RoHS compliance, for your specific application requirements before finalizing procurement orders.
Select this component when a dual-edge female connector with 0.100-inch spacing is required for PCB integration. Consider the 0.062-inch nominal board thickness specification to ensure proper mechanical fit. Evaluate the operating temperature range and material composition against environmental conditions to guarantee long-term reliability in the target assembly.
This part belongs to the EDAC 895 series, which offers standard card edge connectors designed for general-purpose applications. The series provides various position counts and mounting options, catering to diverse electronic assembly needs. The 895-084-555-203 specifically addresses requirements for medium-density connections with standardized dimensions and materials.
Consult the official EDAC cross-reference documentation for verified substitute part numbers. Direct replacements must maintain identical pin counts, spacing, and mounting characteristics to ensure functional equivalence without redesigning the host PCB layout.
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