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A-WBP-C001DG-20SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 1.27MM, 20. Review the specifications below when checking this part for your BOM.
The A-WBP-C001DG-20SR01 is a surface mount connector header manufactured by Assmann WSW Components. It features 90 positions with a 0.050-inch (1.27mm) pitch. The component utilizes solder termination and employs a push-pull fastening mechanism. Insulation height is specified at 0.264 inches (6.70mm), and the contact shape is square.
Verify the exact pin count and pitch against the official datasheet before procurement. Confirm that the surface mount package matches the PCB footprint requirements. Ensure the push-pull fastening mechanism is compatible with the assembly workflow. Check RoHS compliance status if required by project specifications.
Select this component when a high-pin-count surface mount header is required. The 1.27mm pitch offers a balance between density and manufacturability. The push-pull feature simplifies mating in constrained spaces. Verify insulation height compatibility with adjacent components on the board.
This part belongs to the A-WBP series of wafer connectors from Assmann WSW Components. The series focuses on wire-to-board and board-to-board applications using 1.27mm pitch technology. The manufacturer specializes in standard and custom tailored connector solutions for various industrial sectors.
No public confirmed substitute part numbers are available in the provided documentation. Consult the manufacturer for direct equivalents or cross-reference options based on specific mechanical and electrical requirements.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

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