A-WBP-D004EG-11TB01

Headers, Male Pins Overview

The A-WBP-D004EG-11TB01 is a male pin header connector manufactured by Assmann WSW Components. It features an 11-position configuration with a 1.25mm (0.049 inch) pitch. The component utilizes a through-hole mounting style for secure PCB attachment. Designed for wire-to-board applications, it serves as a standard interconnect solution within the A-WBP series.

Headers, Male Pins Feature Summary

• Provides reliable electrical connectivity via male pin contacts
• Supports secure through-hole mounting on printed circuit boards
• Facilitates standardized wire-to-board interconnections

Headers, Male Pins Applications

• General electronic equipment interconnects
• Consumer device internal wiring
• Industrial control panel connections

Headers, Male Pins Procurement Notes

Verify the specific part number against official manufacturer documentation to ensure compatibility with design requirements. Confirm that the 1.25mm pitch and 11-pin configuration match the target PCB footprint. Ensure compliance with relevant environmental standards such as RoHS before finalizing procurement decisions.

Headers, Male Pins Selection Notes

Select this component when a low-profile, 1.25mm pitch male header is required for through-hole assembly. Consider the 11-position count and straight orientation relative to available board space. Evaluate current carrying capacity and voltage ratings against system specifications to ensure safe operation under expected load conditions.

Headers, Male Pins Part Context

This component belongs to the A-WBP series of headers from Assmann WSW Components. The series offers various pin counts and pitch options, including 1.25mm and 2.50mm variants. These connectors are designed for general-purpose connectivity needs across diverse electronic manufacturing applications.

Headers, Male Pins Replacement Considerations

Compatible substitutes include other 11-position, 1.25mm pitch male headers from different manufacturers. Verify mechanical dimensions, contact plating, and thermal resistance before substitution to maintain assembly integrity.